Changzhou Mingseal Robot Technology Co., Ltd.
Changzhou Mingseal Robot Technology Co., Ltd.
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Advanced Flux Jetting Dispenser for Warped Chip Flux Support
The GS600 series is a next-generation inline flux jetting system designed to solve one of the most demanding challenges in semiconductor assembly: flux application on highly warped chips mounted on substrates.
When working with chips prone to significant warpage, maintaining consistent flux coverage is critical to avoid bonding failures and achieve defect-free soldering. The GS600 series meets this need with a combination of high-speed jetting, exceptional positional accuracy, and advanced process monitoring.
Whether used as a standalone station or integrated inline with SMT, DB, or advanced packaging lines, the GS600SS provides the performance and stability manufacturers need for warped chip soldering and underfill processes.
Core Advantages
Reliable flux jetting for warped chips: Maintains uniform application even on substrates with significant warpage.
No splatter, precise targeting: Jetting valve technology ensures clean flux lines and prevents contamination.
Inline glue weight monitoring: Automated weight checks with alarms safeguard quality and consistency.
Self-cleaning jetting head: Reduces downtime and maintains spray performance during extended operations.
Flexible integration: Compatible with various SMT and semiconductor packaging workflows.
Typical Applications
✓ Flux jetting for highly warped chip solder support
✓ Pre-soldering flux coating on uneven substrates
✓ Supplemental flux application before chip bonding
✓ Advanced semiconductor assembly where high-precision flux distribution is critical
Technical Specifications
| Cleanliness Level | Cleanliness of working area | Class 100 |
| Motion System | Max. Dispensing Range (X*Y) | 325*160mm |
| Repeatability (3sigma) | X/Y ≤ ±3 μ m Z ≤ ±5 μm | |
| Positioning Accuracy (3sigma) | X/Y ≤ ±10 μ m Z ≤ ±15 μm | |
| Max. Speed | X/Y:1000mm/s Z: 500mm/s | |
| Max. Acceleration | X/Y:1g, Z:0.5g | |
| Track System | Track Form | Single-track conveying, 3-segment lifting, mid-section operational-lifting mode |
| Track Parallelism | <0.1mm (max-min width variation) | |
| Height Adjustment Range | 890-960mm | |
| Width Adjustment Range | 60-160mm | |
| Max. Convey Speed | 300mm/s | |
| Max. Carrier Load | 3kg | |
| Lifting Method | Track-lifting (fixture remains stationary) | |
| Track Suction Capacity | Cover ±2mm warping of substrates | |
| Heated Bottom-plate | Contact-type Heating (Room temperature -150℃), with Vacuum Suction | |
| Max. Vacuum Suction Pressure | -70KPa - -40KPa | |
| General Condition | Dimension (W*D*H) | 1401*1200*2112mm |
| Environmental Temperature | 23±5℃ | |
| Environmental Humidity | 30-70% |
Q&A
Q1: What makes the GS600 series better for indium sheet flux spraying?
A: Its atomization system ensures flux is applied evenly with a fine 5μm layer, eliminating splatter and maintaining surface cleanliness.
Q2: Can it handle continuous high-volume runs?
A: Yes! The automatic glue weight verification and nozzle self-cleaning ensure long, stable production without manual intervention.
Q3: Is it easy to integrate with other equipment?
A: Absolutely — the GS600SS supports SMEMA interfaces and works seamlessly with SMT, DB, and other semiconductor packaging lines.
Q4: What type of spray valve is recommended?
A: The system can be configured with high-precision spray valves like the KAS1000, designed for tight control and minimal overspray in critical flux applications.
About Mingseal
Mingseal is a trusted name in high-end dispensing solutions for semiconductor, MEMS, optical module, and advanced packaging industries. With years of specialized R&D and deep process experience, we help manufacturers worldwide achieve higher yields, tighter process control, and greater line efficiency with precision dispensing and spraying technologies.
Looking for a smarter way to handle your indium sheet flux spraying? Partner with Mingseal to secure your next-generation production edge.